LEB 2000 Overview

PROCEEDINGS of the Sixth Workshop
on Electronics for LHC Experiments
Kraków, Poland, 11 - 15 September 2000

WORKSHOP OVERVIEW

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The purpose of the workshop was to review the electronics for LHC experiments and to identify areas and encourage common efforts for the development of electronics within and between the different LHC experiments and to promote collaboration in the engineering and physics communities involved in the LHC activities. The programme of the workshop has included both invited plenary talks and parallel working groups for contributed papers, complemented by a poster session. The focus of the workshop has been research and recent development in the following topics:

Radiation and magnetic field tolerant electronics systems
Optoelectronics and data transfer systems
Detector control and real time systems
Packaging and interconnections
Electronics production and test techniques
Systems reliability and quality assurance
Hardware and embedded software maintenance
Electronics for trackers
Electronics for calorimeters
Electronics for muon detectors
Trigger electronics
Low voltage and high voltage distribution
Grounding, shielding cooling and alignment

The welcome address was given by Peter Sharp, Chairman of the CERN LHCC Electronics Board, by Michal Turala , Chairman of the local organising committee and by R. Tadeusiewicz, rector of the University of Mining and Metallurgy.

PLENARY SESSIONS

Chaired by Peter Sharp:

LHC Experimental Program by Roger Cashmore, CERN
Status of the LHC Machine by Lyn Evans, CERN
Electronic Components and Systems for the Control of the LHC Machine by Raymond Rausch, CERN

Chaired by Michal Turala:

ALICE Electronics by Wolfgang Klempt, CERN
ATLAS Electronics by Phillipe Farthouat, CERN
CMS Electronics by Austin Ball, CERN
LHCb Electronics by Jorgen Christiansen, CERN

Chaired by Geoff Hall:

TEMIC Semiconductors policy for foundry procurement by ThierryCorbière, TEMIC, Nantes
Packaging of silicon particle detectors, how to adapt microelectronic processes to large dies by Simondavide Tritto, CSEM, Neuchatel

Chaired by Michael Letheren:

COTS for the LHC radiation environment: the rules of the game by Federico Faccio, CERN
High-density low-mass hybrid and associated technology by Yoshinobu Unno, KEK

Chaired by Wesley Smith:

Timing and Synchronization in the LHC Experiments by Joao Varela, LIP/IST Lisbon & CERN
Controls for the LHC Experiments by Wolfgang von Rueden, CERN

PANEL DISCUSSIONS

The panel discussion on frontend electronics was chaired by Kevin Einsweiler, LBL.
The panel discussion on trigger electronics was chaired by Hans Dijkstra, CERN.

PARALLEL WORKING GROUPS

The two parallel working groups focussed on the system design issues involved in the electronics for :

WORKING GROUP A:

Electronics for Trackers (Chairmen: Michael Letheren, Wladislaw Dabrowski and Emilio Petrolo)
Electronics for Muon Detectors (Chairman: Emilio Petrolo)
Electronics for Calorimeters (Chairman: Steve Quinton)
Radiation and Magnetic Field Tolerant Electronics Systems (Chairman: Steve Quinton and Veljko Radeka)

WORKING GROUP B:

Optoelectronics (Chairman: Wesley Smith)
Trigger Electronics (Chairmen: Wesley Smith and Jorgen Christiansen)
Grounding Shielding and Cooling - Low Voltage / High Voltage (Chairmen: Philippe Farthouat)
Data Acquisition and Detector Control System (Chairmen: Michael Schmelling and Fabio Formenti)

POSTERS

The posters session was chaired by Steve Quinton.

INDUSTRIAL EXHIBITION

Company attending were:
"FIDELTRONIK", ul. Beniowskiego, 34-200 Sucha Beskidzka, Poland
http://www.fideltronik.com/index.html
Mission: Contract Electronic Manufacturing Solutions. ISO9002 quality.
Hardware designs including analog and digital solutions, software
development for microprocessors, standard PCs and embedded systems.
Products: UPS systems, DC power supplies, modems, monitoring software.
"HATRON Electronics", ul. Radzikowskiego 51, 31-305 Kraków, Poland
http://www.hatron.com/index.html
Products: PCBs up to 12 layers, sizes up to 450x540 mm2, laminate
thickness 0.2-3.2 mm, minimal line width 0.15 mm, spacing 0.2 mm
Technology: Cooper, nikel and gold plating by electrolitical process.
Sn/Pb plating by electrolitical or Hot Air Leveling methods. Deposition
of mozaics, soldering masks, labels. Electrical testing.

SPONSORSHIP

The workshop was sponsored by the Polish State Committee for Scientific Research (KBN).

NEXT WORKSHOP

The seventh workshop is expected to take place in Stockholm, Sweden, in September 2001.
Further information will be made available in due course on the World Wide Web.